PCB Assembly and Rework
The Prototyping Facility is equipped with various equipment for assembly and rework of Printed Circuit Boards (PCBs):
- Essemtec Expert-SAFP semi-automatic SMD pick and place system with split optic for fine pitch alignment
- Essemtec RO06-PLUS batch reflow oven for prototypes
- ERSA HR100A rework system with IRHP 100A IR-heating plate
All equipment is intended for high quality prototyping applications.
Semi-Automatic Pick and Place
The Expert-SAFP is designed for prototyping and small batches of PCBs. The semi-automatic placer allows error-free assembly of complex PCBs. The machine in the Prototyping Facility includes an optical microplacer for Ball Grid Array (BGA), micro-BGA and fine pitch placement.
With a process area of 300x400mm, the RO06-PLUS reflow oven is intended for prototyping and small series. Features include an automated soldering process and a combined convection/infrared heating system that ensures homogenous temperature distribution and enables steep ramps.
The ERSA HR/IRHP 100 rework system combines safe infrared radiation and hot air for removal and replacement of surface-mount devices (SMDs). The hybrid tool delivers homogeneous heat to lead-free components ranging from 0201s to 20 x 20 mm SMDs.